Silver-tin alloys have established a superior record of performance for strong, ductile bonds that stand up to unlimited thermal and physical shocks, as well as for prohibiting the build-up of bacteria. Now, a new silver-tin alloy with improved properties is entering the market.
Concern about the health effects of lead in household drinking lines resulted, a few decades ago, in the development of lead-free, silver-bearing solders. These solders are tin-based, with copper as the primary element and silver limited to less than a half-percent by weight. Their drawback is that they have a fairly wide melting/solidification range of about 20F.
The new silver soldering alloy has been patented by the U.S. Department of Energy. The alloy is a mixture of silver with a small addition of copper, and is intended for electronic, electrical and mechanical connections. The silver content is 4.7%; the copper content, 1.7%. The single-temperature melting/solidification point of the alloy solder is beneficial for the manufacture of electronics, as it bonds quickly.
— The preceding appeared in Silver News, a publication of the Washington, D.C.-based Silver Institute.
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